Miniaturized high-temperature pressure sensor chips at the S+T 2018

21.06.2018

At Sensor+Test 2018 in Nuremberg, the CiS Research Institute will present a high-temperature pressure sensor system suitable for series production with an operating temperature of up to 300°C.

The customer-specific development of the high-temperature stable microsystem with piezoresistive sensor elements for extending the operating temperature range within existing systems also has technical properties such as reliability, extreme long-term stability and maximum precision. Within the R&D project, the entire chain from the idea to the finished microsystem was mapped. The development process included the coupled device simulation and layout as well as process development, wafer production, wafer measurement technology and the final component test. The miniaturized high-temperature pressure sensor chip is suitable for special application conditions in process automation and automotive as well as for monitoring and control of industrial processes.

This development and further highlights of the MEMS, MOEMS and Silicon Detectors (SIDE) divisions can be experienced by interested visitors in Hall 1 at booth 1-150 at the "Sensor+Test" in Nuremberg.