Assembly and packaging

In microsystem engineering as a cross-sectional technology, procedures and methods from all kinds of technologies have to be combined with each other to develop and manufacture complex microsystems. The assembly and packaging have major significance for the microsystem’s functionality while taking account of all the environmental effects.
CiS provides clients with all the individual technological steps for assembly and packaging of microsystems.

Our capabilities are especially in

  • Assembly and packaging of components and sensors as complex modules,
  • Assembly and packaging of opto-electronic microsystems and
  • Proposals in response to client-specific technology developments for special assembly and packaging.

 


Besides the well-known standard procedures of micro-assembly there are a whole number of special assembly and packaging technologies.

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